FR-4 copper clad laminated sheet，use glass fiber cloth as substrate material, immersed with epoxy resin, bake into prepreg sheet, combined several prepreg sheets single side or double sides with copper foil, hot pressing, curing, then forming CCL.
FR-4Copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.
|
NO. |
Item |
Unit |
Value |
Typical value | ||
|
1 |
Copper foil peel strength |
125℃ |
N/mm |
≥0.7 |
1.5 |
|
|
float288℃/10sec |
≥1.05 |
1.65 |
||||
|
2 |
Thermal Stress (float288℃/unetched) |
sec |
≥10 |
120 |
||
|
3 |
Warpage (without treatment) |
％ |
≤1.0 |
0.20 |
||
|
4 |
flammability ( UL94) |
– |
V-0 |
V-0 |
||
|
5 |
Vitrification transition temperature |
℃ |
≥130 |
138 |
||
|
6 |
Surface resistivity （35℃ air） |
MΩ |
≥1.0*104 |
1.0*106 |
||
|
7 |
Volume resistivity（35℃ air） |
MΩ/cm |
≥1.0*106 |
1.0*108 |
||
|
8 |
Dielectric constant（1MHz） |
– |
≤5.5 |
5.0 |
||
|
9 |
Dielectric loss factor （1MHz） |
– |
≤0.035 |
0.024 |
||
|
10 |
Arc resistance |
sec |
≥60 |
120 |
||
|
11 |
Moisture absorption |
% |
≤0.8 |
0.3 |
||
|
12 |
Comparative tracking index |
V |
≥150 |
170 |
||
|
13 |
Dimensional stability |
warp |
ppm |
±300 |
-200 |
|
|
fill |
-180 |
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